发明名称 LED LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an LED light emitting device which efficiently conducts radiation operation because a proposed conventional structure, in which a cooled object is placed in contact with a radiator by using a shape memory alloy to radiate heat, has problems such as the instability of the connection state created by the shape memory alloy and the delay in the heat radiation operation conducted in conjunction with the temperature rise of the cooled object.SOLUTION: The LED light emitting device includes: a substrate on which an LED element is mounted; and a housing that is a radiator, the housing to which the substrate is attached. In the LED light element, a heat conduction sheet and a shape memory alloy where volumetric capacity is increased by heating are sandwiched by a rear surface of the substrate and the housing to fix the substrate to the housing.
申请公布号 JP2014110084(A) 申请公布日期 2014.06.12
申请号 JP20120262390 申请日期 2012.11.30
申请人 CITIZEN ELECTRONICS CO LTD;CITIZEN HOLDINGS CO LTD 发明人 YANO TAKAKAZU;WAKATSUKI TOSHIYUKI;HASUMI YUICHI
分类号 F21V29/00;F21S2/00;H01L33/64;H05K7/20 主分类号 F21V29/00
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