| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can uniformize signal propagation time between wirings requiring isometric processing while achieving high density of the wirings and its design method.SOLUTION: A wiring board includes: a first wiring having a first land; a second wiring having a second land larger than the first land and the wiring length longer than the first wiring; one or a plurality of first interlayer connection vias connected to the first land; a plurality of second interlayer connection vias connected to the second land and having the larger number than the first interlayer connection vias; first pad electrodes connected to the first interlayer connection vias; and second pad electrodes connected to the second interlayer connection vias. |
