| 发明名称 |
MULTICHIP PACKAGE AND FABRICATION METHOD THEREOF |
| 摘要 |
A multichip package and a method for manufacturing the same are provided. A multichip package includes: a plurality of semiconductor chips each mounted on corresponding lead frame pads; lead frames connected to the semiconductor chips by a bonding wire; and fixed frames integrally formed with at least one of the lead frame pads and configured to support the lead frame pads on a package-forming substrate. |
| 申请公布号 |
US2014159217(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201313875676 |
申请日期 |
2013.05.02 |
| 申请人 |
KIM Hyun Dong |
发明人 |
KIM Hyun Dong |
| 分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multichip package, comprising:
a plurality of semiconductor chips each mounted on corresponding lead frame pads; lead frames connected to the semiconductor chips by a bonding wire; and fixed frames integrally formed with at least one of the lead frame pads and configured to support the lead frame pads on a package-forming substrate.
|
| 地址 |
Goyang-si KR |
