LOW COST REPACKAGING OF THINNED INTEGRATED DEVICES

摘要

A method for mounting and embedding a thinned integrated circuit within a substrate is provided. In one embodiment, the thinned integrated circuit can receive one or more biasing substrate layers on a first surface of the thinned integrated circuit. When the thinned integrated circuit is embedded within a supporting substrate, such as a printed circuit board, the biasing substrate layers can position the thinned integrated circuit toward a centerline of the printed circuit board. Positioning the thinned integrated circuit toward the centerline can increase the resistance to breakage.

主权项

1. A method for forming a printed circuit assembly including a thinned integrated circuit, the method comprising:
receiving a thinned integrated circuit; attaching additional substrate layers to the thinned integrated circuit forming a thinned integrated circuit sub-assembly; affixing the thinned integrated circuit sub-assembly to a cavity within a printed circuit board (PCB) substrate such that the thinned integrated circuit sub-assembly is aligned about mid-plane to a centerline of the PCB substrate; and, coupling at least one additional PCB substrate layer to cover the thinned integrated circuit sub-assembly.