| 发明名称 |
LASER ANNEALING DEVICE AND METHOD |
| 摘要 |
A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser. |
| 申请公布号 |
US2014162381(A1) |
申请公布日期 |
2014.06.12 |
| 申请号 |
US201313935265 |
申请日期 |
2013.07.03 |
| 申请人 |
Semiconductor Manufacturing International Corporation (Shanghai) |
发明人 |
CAI BoXiu |
| 分类号 |
H01L21/263 |
主分类号 |
H01L21/263 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A laser annealing device, comprising:
a pump laser source array including a plurality of pump laser sources, the pump laser sources each emitting a pump laser beam; an annealing laser source for emitting annealing laser; and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.
|
| 地址 |
Shanghai CN |
