发明名称 Ceramic Filled Fluoropolymer Compositions, Methods and Applications Thereof
摘要 The present disclosure is in the field of electrical circuits and particularly to circuits characterized by plural conductive paths supported on a non-conductive substrate. The disclosure relates to ceramic filler compositions and methods for preparing said compositions. Further, the present disclosure discloses fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for preparing the same. Said fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials comprising of a conductive outer layer supported on a thin sheet of insulating material is also disclosed.
申请公布号 US2014162065(A1) 申请公布日期 2014.06.12
申请号 US201314104002 申请日期 2013.12.12
申请人 Centre for Materials for Electronics Technology (C-MET) ;The Secretary, Dept. of Electronics and IT, Govt. of India 发明人 SURENDRAN Rajesh;PURUSHOTHAMAN Murali Kodakkattumana;RAVENDRAN Ratheesh
分类号 H01B3/12;B32B15/08 主分类号 H01B3/12
代理机构 代理人
主权项
地址 Thrissur IN