发明名称 |
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A light emitting device includes a light source module and a secondary optical element. The optical element includes a light incident surface and a light radiating surface opposite to the light incident surface. The light source module includes at least one light emitting unit, and the light emitting unit includes a light emitting diode (LED) chip and an encapsulation layer. The encapsulation layer includes a light outputting surface. The light incident surface faces to the light outputting surface. A gap is defined between the light outputting surface and the light incident surface, and a transparent colloid is filled in the gap. The transparent colloid has a refractive index similar to that of the second optical element and the encapsulation layer. A method for manufacturing the light emitting device is also provided. |
申请公布号 |
US2014159069(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
US201314067913 |
申请日期 |
2013.10.30 |
申请人 |
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. |
发明人 |
TSAI MING-TA;HSU CHIH-PENG;CHANG CHUNG-MIN |
分类号 |
H01L33/56 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
1. A light emitting device, comprising:
a light source module comprising at least one light emitting unit, the at least one light emitting unit comprising a light emitting diode (LED) die and an encapsulation layer covering the LED die, the encapsulation layer comprising a light outputting surface; a secondary optical element comprising a light incident surface and a light radiating surface opposite to the light incident surface, the light incident surface facing to the light outputting surface, a gap being defined between the light outputting surface and the light incident surface; and a transparent colloid, the transparent colloid filled in the gap and intimately contacting the light incident surface of the encapsulation layer and the light incident surface of the secondary optical element.
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地址 |
HSINCHU HSIEN TW |