发明名称 TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
摘要 Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.
申请公布号 US2014158255(A1) 申请公布日期 2014.06.12
申请号 US201314071928 申请日期 2013.11.05
申请人 Gerrard David Peter;Roy Sayantan 发明人 Gerrard David Peter;Roy Sayantan
分类号 B23K35/24 主分类号 B23K35/24
代理机构 代理人
主权项 1. A solder composition comprising: a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy; where the metal or metal alloy forms a matrix of the solder composition.
地址 Montgomery TX US