发明名称 |
TOUGHENED SOLDER FOR DOWNHOLE APPLICATIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME |
摘要 |
Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. |
申请公布号 |
US2014158255(A1) |
申请公布日期 |
2014.06.12 |
申请号 |
US201314071928 |
申请日期 |
2013.11.05 |
申请人 |
Gerrard David Peter;Roy Sayantan |
发明人 |
Gerrard David Peter;Roy Sayantan |
分类号 |
B23K35/24 |
主分类号 |
B23K35/24 |
代理机构 |
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代理人 |
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主权项 |
1. A solder composition comprising:
a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy; where the metal or metal alloy forms a matrix of the solder composition.
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地址 |
Montgomery TX US |