MULTILAYER POLYVINYLIDENE FILMS STRUCTURES

摘要

The invention relates to a multi-layer weatherable film structure having an outer layer of a highly weatherable film, a layer having a high thermal deformation temperature, an optional tie layer, and a thin layer of polyolefin or polyamide. The highly weatherable film layer preferably is polyvinylidene fluoride. The polyolefin or polyamide layer is less than 500 microns in thickness, and preferably the whole film structure is less than 750 microns thick. The polyolefinjpolyamide side of the film structure can easily be adhered to many different substances—especially polyolefins and polyamides. This film can be used to provide a highly weatherable protective layer a substrate. One useful application for the film is in a photovoltaic module to protect the back side of the module from weathering and abrasion. The multi-layer film structure can be adhered to a typical polyolefin-based encapsulant layer and used as a backsheet encapsulant in a photovoltaic module.

主权项

1. A multilayer film structure comprising, in order:
a) a highly weatherable layer; b) a high deformation temperature layer; e) an optional tie layer; and d) a polyolefin or polyamide layer; wherein a single polyamide layer could function as both the high thermal deformation temperature layer b), and also the polyamide layer d) without any tie layer c); wherein each layer is adhered to one another in their respective contact regions; wherein the total film thickness is greater than 12 microns and less than 750 microns, and wherein each layer is thermoplastic.