| 摘要 |
<p>This protective-membrane-forming film, which is used to form a protective membrane that protects a semiconductor chip, contains an acrylic polymer (A), a curable epoxy component (B), a filler (C), and a silane coupling agent (D1). Either the monomers that constitute said acrylic polymer (A) do not include any epoxy-group-containing monomers or epoxy-group-containing monomers constitute no more than 8% of the total mass of the monomers constituting the acrylic polymer (A). The glass transition temperature of the acrylic polymer (A) is greater than or equal to−3°C, and the molecular weight of the silane coupling agent (D1) is greater than or equal to 300.</p> |
