METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS

摘要

A method for manufacturing a semiconductor wafer of the present invention is a method for manufacturing a semiconductor wafer which discharges a plurality of wafers with a small-diameter from the semiconductor wafer with a large-diameter. The method comprises: a marking process for collectively forming straight groove-like orientation flat lines for each column by a laser light by disposing discharging positions of the small-diameter wafers in a row to a specific direction on the large-diameter semiconductor wafer and by crossing each of the small-diameter wafers in each row; and a discharging process for individually discharging the small-diameter wafers from the large-diameter semiconductor wafer by the laser light after the marking process.