APPARATUS FOR SEPARATING SUBSTRATE AND METHOD FOR SEPARATING SUBSTRATE USING THE SAME

摘要

An apparatus for separating a substrate and a method for separating a substrate using the same are disclosed. The apparatus for separating a substrate comprises: a high-pressure chamber having a gas injection section; a low-pressure chamber having a gas discharge section; and a passage for connecting the high-pressure chamber and the low pressure chamber. The method for separating the substrate comprises; preparing a wafer having a channel between a growth substrate and an epi layer; injecting an etch solution to the channel on one side of the wafer; and discharging the etch solution from the channel on the other side of the wafer, wherein the pressure of the one side of the wafer is higher than the pressure of the other side of the wafer. According to the present invention, a time for processing the substrate separation can be shortened, and an effect capable of separating a substrate with a large area can be provided.