| 摘要 |
Earphone apparatus (40) comprising: a substantially planar substrate (43) defining at least one electrical connection path (44); an electro-acoustic driver (41) and sensing microphone (42) each mounted on the substrate (43) and connected to the at least one electrical connection path (44); wherein the substrate (43) at least in part defines an acoustic waveguide (47) having a part extending through the substrate (43) for conveying sound from outside of the earphone apparatus (40) to the sensing microphone (42); and the part of the acoustic waveguide (47) extends through the substrate (43) substantially normal to the thickness of the substrate (43). |
