SPUTTERING APPARATUS AND METHOD OF MANUFACTURING DISPLAY SUBSTRATE USING THE SAME

摘要

A sputtering apparatus of the present invention includes a chamber; a substrate fixing part arranged inside the chamber; multiple targets corresponding to the substrate fixing part; a target fixing part arranged under each target to fix the target; a first ground part which is arranged between two adjacent target fixing parts and includes a attachable and detachable cover; and a second ground part arranged between two adjacent target fixing parts except a part on which the first ground part is arranged. The sputtering apparatus can remove impurities that can be generated during a sputtering process while maintaining the potential to form plasma. Moreover, the sputtering apparatus forms a substrate by cutting the substrate along a cutting line of the substrate that corresponds to the first ground part, thus does not affect the quality of the display substrate.