发明名称
摘要 A wireless IC device includes a wireless IC chip, a power feeding circuit substrate including a power feeding circuit including inductance elements, and radiation plates including plate-shaped coupling units. The inductance elements have spiral shapes and are wound in directions opposite to each other. The plate-shaped coupling units in the radiation plates are disposed in a vicinity of the inductance elements so as to be perpendicular or substantially perpendicular to the winding axes of the inductance elements, and eddy currents occur in the plate-shaped coupling units so as to couple the power feeding circuit and the radiation plates with each other. The plate-shaped coupling units may also have spiral shapes.
申请公布号 JP5516580(B2) 申请公布日期 2014.06.11
申请号 JP20110519679 申请日期 2010.04.30
申请人 发明人
分类号 H01Q1/50;G06K19/07;G06K19/077;H01Q1/38 主分类号 H01Q1/50
代理机构 代理人
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