| 摘要 |
<p>The present invention provides a composite chamfer processing device for ingot with features of short processing time and miniaturized area occupied. The invented composite chamfer processing device 1 uses a pair of cup-shaped grinding-disk-type first polishing grinding disks 11g, 11g for performing a coarse polishing and chamfering on four corners of R face of a column ingot, which is obtained by using a pair of rotary blades 91a, 91b of a cutter device to perform peeling processing on the four sides of a cylindrical ingot, then uses a pair of cup-shaped grinding-disk-type second polishing grinding disks 10g, 10g for performing polishing grinding chamfering on the four sides of ingot, and then uses a grinding lathe 9g for polishing the four corners R of ingot, thereby producing a column ingot.</p> |
