发明名称 |
HIGH IMPACT TOUGHNESS SOLDER ALLOY |
摘要 |
High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities. |
申请公布号 |
EP2739432(A1) |
申请公布日期 |
2014.06.11 |
申请号 |
EP20120756540 |
申请日期 |
2012.08.02 |
申请人 |
ALPHA METALS, INC. |
发明人 |
PANDHER, RANJIT;SINGH, BAWA;SARKAR, SIULI;CHEGUDI, SUJATHA;KUMAR, ANIL K. N.;CHATTOPADHYAY, KAMANIO;LODGE, DOMINIC;DE AVILA RIBAS, MORGANA |
分类号 |
B23K35/26;C22C12/00;C22C13/02 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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