| 摘要 |
In a method of manufacturing an electronic component according to the present invention, a stage is moved in a +X direction and a substrate is cut by a rotary blade while the rotary blade is rotated in one direction in which an outer peripheral portion of the rotary blade proceeds from a surface (upper surface) of the substrate, which is an uppermost layer, toward an inside of the substrate. Continuously, a two layer structure resin sealing member including the substrate and a sealing resin is cut by moving the stage in a -X direction and cutting the sealing resin with the rotary blade while the outer peripheral portion of the rotary blade proceeds from a surface (lower surface) of the sealing resin, which is a lowermost layer, toward an inside of the sealing resin. Accordingly, chipping and burs which may be generated when the resin sealing member is collectively cut using the rotary blade can be restrained. |
