| 发明名称 |
LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE |
| 摘要 |
<p>The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.</p> |
| 申请公布号 |
PT2467441(E) |
申请公布日期 |
2014.06.11 |
| 申请号 |
PT20100810577T |
申请日期 |
2010.08.19 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
YUHONG HU;MARIA XENIDOU;ALETHEA POLLOCK-DOWNER;MATTHEW SHARAK;CRISTINA, B. DEJESUS |
| 分类号 |
C09J123/02 |
主分类号 |
C09J123/02 |
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