发明名称 PLASMA ACTIVATED CONFORMAL DIELECTRIC FILM DEPOSITION
摘要 Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by intermittent delivery of dopant species to the film between the cycles of adsorption and reaction.
申请公布号 KR20140071402(A) 申请公布日期 2014.06.11
申请号 KR20147008696 申请日期 2012.08.21
申请人 NOVELLUS SYSTEMS, INC. 发明人 LAVOIE ADRIEN;SRIRAM MANDYAM
分类号 H01L21/205;H01L21/31 主分类号 H01L21/205
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