| 摘要 |
The present invention provides a lead frame which comprises: a) a positive electrode unit as a heat sink which has at least one heat dissipating hole and is consisted of a conductive metal; b) a negative electrode unit which is disposed on the positive electrode unit and has i) chip bonding portion connected to a LED chip to conduct electricity and ii) an external terminal to conduct electricity with the outside; and c) a lead frame injecting material which is disposed on the genitive electrode unit and has i) a chip bonding portion disposed at a position corresponding to the chip bonding portion of the negative electrode unit and ii) a heat radiation pattern having at least one heat dissipation hole around the chip bonding portion, and a LED package comprising the lead frame. |
