| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that exhibits excellent heat resistance and low thermal expansion and further achieves good solvent solubility, a cured product of the same, and a printed wiring board, and a novel epoxy resin which provides such performance. SOLUTION: A novel epoxy resin expressed by structural formula (i) is used as a base resin of varnish for a printed wiring board. In formula, Rs are each independently a hydrogen atom, a 1-4C hydrocarbon group, or a 1-2C alkoxy group; and Xs are each independently a hydrogen atom or a group having an epoxy group which is ether-bonded to a naphthalene ring, wherein at least one of Xs is the group having an epoxy group which is ether-bonded to a naphthalene ring. COPYRIGHT: (C)2012,JPO&INPIT |
