| 摘要 |
<p>The formulation comprises 0.5-30 wt.% of silver metal particles having effective particle diameter of 40-80 Nm with bimodal size distribution, 50-99.5 wt.% of water as a solvent, 0.01-10 wt.% of polymer dispersion agent, 0-5 wt.% of film formers, 0-5 wt.% of additives, and 0-5 wt.% of conductive polymers. The formulation has a maximum viscosity of 150 mPa. Independent claims are included for: (1) a method for producing circuit traces of a line-width with the help of the ink jet technology; and (2) a substrate, particularly transparent plastic substrate having an electrical conductive or optical coating.</p> |
