发明名称 |
Through via inductor or transformer in a high-resistance substrate with programmability |
摘要 |
<p>An inductor formed in a high-resistance substrate, the inductor comprising: a plurality of through-vias in the high-resistance substrate; a plurality of conductive traces on the top surface of the substrate, each conductive trace coupling one of the through-vias to another of the through-vias; and a plurality of conductive traces on the bottom surface of the substrate, each conductive trace coupling one of the through-vias to another of the through-vias; wherein, the plurality of conductive traces on the top and bottom surfaces and the plurality of through-vias form a continuous conductive path.</p> |
申请公布号 |
EP2741303(A2) |
申请公布日期 |
2014.06.11 |
申请号 |
EP20140155264 |
申请日期 |
2011.05.31 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
LI, XIA;KIM, JONGHAE;LO, CHI SHUN |
分类号 |
H01F17/00;H01F21/08;H01F27/28;H01F41/04;H01L21/48;H01L23/15;H01L23/64;H05K1/16 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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