发明名称 Through via inductor or transformer in a high-resistance substrate with programmability
摘要 <p>An inductor formed in a high-resistance substrate, the inductor comprising: a plurality of through-vias in the high-resistance substrate; a plurality of conductive traces on the top surface of the substrate, each conductive trace coupling one of the through-vias to another of the through-vias; and a plurality of conductive traces on the bottom surface of the substrate, each conductive trace coupling one of the through-vias to another of the through-vias; wherein, the plurality of conductive traces on the top and bottom surfaces and the plurality of through-vias form a continuous conductive path.</p>
申请公布号 EP2741303(A2) 申请公布日期 2014.06.11
申请号 EP20140155264 申请日期 2011.05.31
申请人 QUALCOMM INCORPORATED 发明人 LI, XIA;KIM, JONGHAE;LO, CHI SHUN
分类号 H01F17/00;H01F21/08;H01F27/28;H01F41/04;H01L21/48;H01L23/15;H01L23/64;H05K1/16 主分类号 H01F17/00
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