| 摘要 |
Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the chamber division part uses a shielding frame, and other parts including an edge part and a surface part of the whole machine use a conducting material for shielding, thereby having little effect on a size of the whole machine; moreover, the cutting height is decreased because the plastic package material changes from originally needing to be directly cut to a surface of a PCB to directly being cut to the surface of the shielding frame, the processing time is short, and good manufacturability is provided. |
