| 摘要 |
A semiconductor device having a substrate including a plurality of external terminals on a rear surface and a plurality of bonding terminals electrically connected to the plurality of external terminals on a front surface, a semiconductor chip mounted on the front surface of the substrate, a surface of the chip including a plurality of bonding pads, a plurality of bonding wires connecting between the plurality of bonding pads or between the plurality of bonding terminals and the plurality of bonding wires respectively, a first sealing layer sealing the front surface of the substrate, the plurality of bonding wires and the semiconductor chip, and a second sealing layer comprised of the same material as the first sealing, the second sealing layer being formed above the first sealing layer. |
