| 发明名称 |
ULTRAFAST HEAT/ROOM TEMPERATURE ADHESIVE COMPOSITION FOR BONDING APPLICATIONS |
| 摘要 |
<p>The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to two-part, halogen-free curable compositions which are capable of rapidly curing at room temperatures as well as at elevated temperatures.</p> |
| 申请公布号 |
EP2449047(A4) |
申请公布日期 |
2014.06.11 |
| 申请号 |
EP20100794699 |
申请日期 |
2010.06.30 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
LEVANDOSKI, SUSAN, L.;LITKE, ALAN, E.;LOVE, TERESA, A. |
| 分类号 |
C09J125/10;C08F220/10;C08F222/10;C08L25/10;C08L33/06;C09J4/06;C09J11/00;C09J153/02 |
主分类号 |
C09J125/10 |
| 代理机构 |
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