| 摘要 |
A wafer carrier and a system thereof are disclosed. The wafer carrier according to an embodiment of the present invention prevents the thermal deformation of the wager carrier and prevents the damage of the wafer by including: a first frame which has a first settling part in which the wafer is settled in at least one part of area which is in contact with the edge of one side of the wafer and is formed with a material which has a thermal expansion coefficient which is less than or equal to a preset reference value; a second frame which has a second settling part in which the wafer is settled in at least one area which is in contact with the edge of one side of the wafer and is formed with a material which has the thermal expansion coefficient which is less than or equal to the preset reference value; a first combing part which includes a hinge part partially combining the first frame with the second frame and has the first frame and the second frame formed with a material which has a thermal expansion coefficient of 1x10^(-5) to 1x10^(-10), formed to surround the outside of the first frame, and comprised of a material which is different from the first frame; and a second combining part which is formed to surround the outside of the second frame and is comprised of a material which is different from the second frame. |
