Power cycling test arrangement

摘要

A device instructs a power supply to provide a current to a power cycling test structure that includes a heat source interconnected with a package, via a first level interconnect mechanism, and a printed circuit board (PCB) interconnected with the package, via a second level interconnect mechanism. The device also monitors thermal feedback associated with the heat source, and monitors, based on the provided current, voltage feedback associated with the power cycling test structure. The device further determines a thermal profile of the power cycling test structure based on the thermal feedback and the voltage feedback.

主权项

1. A computing device-implemented method, comprising:
providing, via the computing device, a current to a power cycling test structure that includes a heat source interconnected with a package via a first level interconnect mechanism, and a printed circuit board (PCB) interconnected with the package via a second level interconnect mechanism; monitoring, by the computing device, thermal feedback associated with the heat source; monitoring, by the computing device, voltage feedback associated with the power cycling test structure; and determining, by the computing device, a thermal profile of the power cycling test structure based on the thermal feedback and the voltage feedback.