发明名称 |
Structure for inspecting defects in word line array fabricated by SADP process and method thereof |
摘要 |
This invention provides a test structure for inspecting word line array fabricated by SADP process, wherein the test structure comprises a contour circuit to cover one end of the WL array, and is alternatively float and ground to the word line array. The word line array then can be inspected by using E-beam inspection tool to identify open and short defects. |
申请公布号 |
US8748814(B1) |
申请公布日期 |
2014.06.10 |
申请号 |
US201313826015 |
申请日期 |
2013.03.14 |
申请人 |
Hermes Microvision Inc. |
发明人 |
Xiao Hong;Jau Jack |
分类号 |
H01J37/153;G01R31/02 |
主分类号 |
H01J37/153 |
代理机构 |
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代理人 |
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主权项 |
1. A test structure for a conductive line array of a device, comprising:
a contour circuit on a substrate to be inspected covering one end of the conductive line array on the substrate and alternatively floating and grounding the conductive line array, thereby a short defect between any two conductive line of the conductive line array or an open defect of one conductive line of the conductive line array can be identified in an inspection process.
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地址 |
Hsinchu TW |