System and method of forming a patterned conformal structure

摘要

A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

主权项

1. A conformal structure comprising:
a dielectric coating shaped to conform to a surface of an electrical system having a plurality of circuit components mounted thereon, the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system; and a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads, the patterned conductive coating comprising: an interconnect system electrically connected with a ground plane of the electrical system by way of a direct metallic connection to the contact pads; and a plurality of shielding structures configured to protect the circuit components from radio frequency (RF) interference and electromagnetic (EM) interference, wherein each of the plurality of shielding structures is formed over a respective one of the plurality of circuit components so as to conform to the respective circuit component; wherein each of the plurality of shielding structures is separate from others of the plurality of shielding structures such that the plurality of shielding structures are formed discontinuous from one another and such that the plurality of shielding structures do not cover an entirety of the dielectric coating; and at least one thru silicon via structure extending out from the surface of the electrical system and extending out through the dielectric coating and into the patterned conductive coating.