Semiconductor package with integrated interference shielding and method of manufacture thereof

摘要

An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.

主权项

1. A method of manufacturing a module having an integrated electromagnetic interference shield comprising:
connecting an electronic device to a substrate having a plurality of metallizations thereon; forming a plurality of resilient wirebond springs connected to the metallizations and surrounding the electronic device, each wirebond spring including a wire loop having first and second ends connected to the metallizations; encapsulating the electronic device in mold compound that least partially covers the plurality of resilient wirebond springs; disposing a conductive layer on a surface of the mold compound that is electrically connected to at least some of the plurality of resilient wirebond springs and together with the at least some of the plurality of resilient wirebond springs forms the integrated electromagnetic interference shield around the electronic device; depositing a wire ball on the metallizations; and drawing wire from the wire ball to form the wire loop having the first end connected to the wire ball, a crest, a convex region extending between a zone of inflection and the crest, a sloping tail region ending in the second end connected to the metallizations, and a substantially flat region extending between the crest and the sloping tail region, the zone of inflection being between the convex region and the wire ball.