WAFER SUPPORT SYSTEM AND METHOD FOR BONDING AND DEBONDING WAFER USING THE SAME

摘要

The present invention relates to a wafer support device and a method for bonding and debonding a wafer using the same and, more specifically, to a wafer support device and a method for bonding and debonding a wafer using the same which bond the wafer on a wafer support of the wafer support device, perform a process such as back grinding, and then easily debond the wafer from the wafer support. The present invention provides the wafer support device and the method for bonding and debonding the wafer using the same, which perforate a plurality of debonding holes on the wafer support, apply an adhesive on the support, bond the wafer on the support, and easily intrude a debonding tool (a chemical solution, air, heating, etc.) into a bottom part of the wafer via the debonding holes, thereby easily debonding the wafer from the wafer support.