发明名称 |
Non-volatile memory utilizing impact ionization and tunnelling and method of manufacturing thereof |
摘要 |
A non-volatile memory device (and method of manufacture) is disclosed and structured to enable a write operation using an ionization impact process in a first portion of the device and a read operation using a tunneling process in a second portion of the device. The non-volatile memory device (1) increases hot carrier injection efficiency, (2) decreases power consumption, and (3) enables voltage and device scaling in the non-volatile memory devices. |
申请公布号 |
US8750037(B2) |
申请公布日期 |
2014.06.10 |
申请号 |
US20090456440 |
申请日期 |
2009.06.16 |
申请人 |
Globalfoundries Singapore PTE. Ltd. |
发明人 |
Toh Eng Huat;Tan Chung Foong;Tan Shyue Seng;Lee Jae Gon;Quek Elgin |
分类号 |
G11C16/04 |
主分类号 |
G11C16/04 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a non-volatile memory device, the method comprising:
providing a substrate; forming a source region within the substrate, the source region comprising dopants of a first conductivity type; forming a drain region within the substrate, the drain region comprising dopants of a second conductivity type; forming a gate structure having at least a portion embedded in the substrate between the source region and the drain region, and wherein the gate structure comprises a tunnel oxide layer, a floating gate formed over the tunnel oxide layer and a control gate formed over the floating gate; forming an ionization impact region between the source region and the gate structure; and forming a halo region in the drain region at a location adjacent the gate structure, the halo region comprising dopants of the first conductivity type.
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地址 |
Singapore SG |