| 摘要 |
The present invention relates to an ultrasonic scrubber for semiconductor fabrication facilities, and more particularly to an ultrasonic scrubber having a heat blocking function, which is provided at a predetermined place including a pipe to transfer waste gas of semiconductor fabrication facilities and a high-temperature heat treatment chamber to transfer ultrasonic vibration, thereby preventing dust from being stuck. The present invention provides an ultrasonic scrubber for semiconductor fabrication facilities including: a scrubber chamber placed on an exhaust path of waste gas emitted from a semiconductor process chamber; an ultrasonic wave transfer band closely fixed to an outer circumference of the scrubber chamber while surrounding the outer circumference of the scrubber chamber; a vibration transfer member fixedly attached to the ultrasonic wave transfer band; an ultrasonic horn having one end fixedly coupled to the vibration transfer member; an ultrasonic transducer coupled to an opposite end of the ultrasonic horn to provide ultrasonic vibration; an ultrasonic transducer drive power amplifier for electrically driving the ultrasonic transducer; and a cooling unit having a cylindrical shape, having a hole formed through both circular surfaces, and coupled to the ultrasonic horn passing through the hole, thereby blocking heat from being conducted to the ultrasonic transducer, minimizing the loss of ultrasonic vibration energy, and ensuring the efficiency and the safety of the ultrasonic transducer. |
