发明名称 Replacement metal gate transistors using bi-layer hardmask
摘要 Methods of fabricating replacement metal gate transistors using bi-layer a hardmask are disclosed. By utilizing a bi-layer hardmask comprised of a first layer of nitride, followed by a second layer of oxide, the topography issues caused by transition regions of gates are mitigated, which simplifies downstream processing steps and improves yield.
申请公布号 US8748252(B1) 申请公布日期 2014.06.10
申请号 US201213684869 申请日期 2012.11.26
申请人 International Business Machines Corporation 发明人 Leobandung Effendi;Cote William;Economikos Laertis;Kim Young-Hee;Park Dae-Gyu;Standaert Theodorus Eduardus;Stein Kenneth Jay;Suh YS;Yang Min
分类号 H01L21/8234;H01L29/66 主分类号 H01L21/8234
代理机构 代理人
主权项 1. A method of fabricating a replacement metal gate transistor, comprising: depositing a dummy gate, wherein the dummy gate comprises an N-type region,a P-type region, anda transition region; depositing a bi-layer over the dummy gate,wherein the bi-layer comprises a first sub-layer comprised of nitride, anda second sub-layer comprised of a first oxide layer; depositing a conformal nitride layer over the dummy gate; forming a first set of spacers adjacent to the dummy gatein the N-type region; forming a second set of spacers adjacent to the dummy gatein the P-type region; depositing a second oxide layer to cover the bi-layer, the first set of spacers, and the second set of spacers; planarizing the second oxide layer to leave a remaining portion with a height at the level of the top of the conformal nitride layer; and recessing the second oxide layer to the level of the first sub-layer of nitride.
地址 Armonk NY US