Bonded structure with enhanced adhesion strength

摘要

A first bonding material layer is formed on a first substrate and a second bonding material layer is formed on a second substrate. The first and second bonding material layers include a metal. Ions are implanted into the first and second bonding material layers to induce structural damages in the in the first and second bonding material layers. The first and second substrates are bonded by forming a physical contact between the first and second bonding material layers. The structural damages in the first and second bonding material layers enhance diffusion of materials across the interface between the first and second bonding material layers to form a bonded material layer in which metal grains are present across the bonding interface, thereby providing a high adhesion strength across the first and second substrates.

主权项

1. A method of forming a bonded structure, said method comprising:
forming a first bonding material layer on a surface of a first substrate; forming a second bonding material layer on a surface of a second substrate, wherein said first and second bonding material layers include at least one metallic material layer; amorphizing said at least one metallic material layer by implanting ions into said at least one metallic material layer; and bringing into physical contact and annealing said first and second bonding material layers, whereby said first and second bonding material layers are bonded to each other to provide adhesion strength between said first and second substrates.