SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

摘要

The present technique relates to a semiconductor device and a method for forming the same. The semiconductor device of the present technique comprises: a semiconductor structure in which an opening for exposing a pad on one surface is formed; a first conductive layer for flattening the one surface of the semiconductor structure by being formed on the opening; and a conductive pattern printed on a portion of the one surface of the semiconductor structure including the first conductive layer.