| 发明名称 |
Mounting method and mounting device |
| 摘要 |
A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region. |
| 申请公布号 |
US8749068(B2) |
申请公布日期 |
2014.06.10 |
| 申请号 |
US201013519243 |
申请日期 |
2010.12.24 |
| 申请人 |
Tokyo Electron Limited |
发明人 |
Nakamura Michikazu;Sugiyama Masahiko;Shinozaki Dai;Akiyama Naoki |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mounting method of sequentially mounting elements on a substrate, the mounting method comprising:
a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated; and a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
|
| 地址 |
Tokyo JP |
