ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER

摘要

The present invention relates to an adhesive film for protecting the surface of a semiconductor wafer including an adhesive layer containing a silane coupling agent, and more specifically, to an adhesive film for protecting the surface of a semiconductor wafer, wherein the increase rate of a void area is 10% or less 12 hours after the film is attached to the bump forming face of the semiconductor wafer.