Metal ring techniques and configurations

摘要

Embodiments of the present disclosure provide an apparatus comprising a substrate layer, a metal ring structure disposed on the substrate layer, the metal ring structure having an opening defined therein, and a solder mask layer coupled to (i) the metal ring structure and (ii) the substrate layer through the opening defined in the metal ring structure, the solder mask layer having a solder mask opening defined therein, wherein an edge of solder mask material defining the solder mask opening overlaps a portion of the opening defined in the metal ring structure. Other embodiments may be described and/or claimed.

主权项

1. An integrated circuit package assembly comprising:
a substrate layer; a metal ring structure disposed on the substrate layer, wherein the metal ring structure includes an opening defined in the metal ring structure; a solder mask layer, wherein the solder mask layer is coupled to (i) the metal ring structure, and (ii) the substrate layer through the opening defined in the metal ring structure, and wherein the solder mask layer includes an opening defined in the solder mask layer; a die coupled to the solder mask layer; and a bonding wire bonded to (i) a surface of the die, and (ii) the metal ring structure through the opening defined solder mask layer, wherein the bonding wire is bonded to the metal ring structure in a bonding area of the metal ring structure that is adjacent to a terminating edge of the metal ring structure.