Joining method and semiconductor device manufacturing method

摘要

A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.

主权项

1. A joining method for joining a semiconductor chip and a lead frame to each other, comprising the steps of:
tentatively assembling a semiconductor chip and a lead frame, wherein the lead frame has an oval shaped slit and a supply port comprising a plurality of openings extending through the lead frame, the openings being respectively provided at both sides of the oval shaped slit, wherein a space is provided between the tentatively assembled semiconductor chip and lead frame; supplying a solid joining material, having a fixed, predetermined shape, through the plurality of openings and into the space between said tentatively assembled semiconductor chip and lead frame, such that the solid joining material engages the semiconductor chip; melting the solid joining material supplied in the space by introducing the tentatively assembled semiconductor chip and lead frame, having the solid joining material supplied in the space, into a reflow oven; and solidifying said melted joining material, whereby the semiconductor chip and the lead frame are joined by the solidified joining material.