Semi-rigid radio frequency identification (RFID) card, manufacturing method and machine for its production

摘要

The invention comprises an RFID card consisting of at least one upper layer, one lower layer, one functional layer comprising at least one electronic component, an antenna connected to the electronic component, wherein the card also comprises a compensator between the functional layer and the lower layer, the compensator being recessed at the location of the electronic component and of thickness substantially equal to the thickness of the electronic component on the functional layer and in that the layers are assembled together by adhesion. The invention also comprises the continuous manufacturing method of the RFID card and the machine according to the manufacturing method of the RFID card.

主权项

1. A manufacturing method for a semi-rigid RFID card, the method comprising the following steps in the following order:
continuously feeding strips by reels, said strips each having a width at least equal to a dimension of a RFID card and defining an upper layer, a lower layer, and a compensator of the RFID card; continuously printing an outer surface of the strip of the lower layer; continuously recessing the strip of the compensator to form a recess; continuously adhering the strip of the compensator to an inner face of the strip of the lower layer or to an inner surface of the strip of the upper layer with a layer of adhesive durably holding the strip of the compensator with the strip of the lower layer or with the strip of the upper layer; continuously feeding at least one strip of a functional layer of the RFID card by at least another reel, the at least one strip of the functional layer having an antenna etched or printed thereon; continuously adhering the at least one strip of the functional layer to the strip of the compensator by placing an electronic component from the at least one strip of the functional layer in coincidence with the recess of the strip of the compensator after having continuously adhered the strip of the compensator to an inner face of the strip of the lower layer or to an inner surface of the strip of the upper layer, and after having continuously fed at least one strip of the functional layer; continuously pressurising the at least one strip of the functional layer with the strip of the compensator after placing the electronic component in coincidence with the recess of the strip of the compensator; continuously adhering the at least one strip of the functional layer to the inner face of the strip of the upper layer or to the inner face of the strip of the lower layer with another layer of adhesive durably holding the strip of the functional layer with the strip of the upper layer or the strip of the lower layer; and continuously cutting.