发明名称 Methods of fabricating fin structures
摘要 There is provided fin methods for fabricating fin structures. More specifically, fin structures are formed in a substrate. The fin structures may include two fins separated by a channel, wherein the fins may be employed as fins of a field effect transistor. The fin structures are formed below the upper surface of the substrate, and may be formed without utilizing a photolithographic mask to etch the fins.
申请公布号 US8748280(B2) 申请公布日期 2014.06.10
申请号 US201113324520 申请日期 2011.12.13
申请人 Micron Technology, Inc. 发明人 Tang Sanh D.;Haller Gordon
分类号 H01L21/336 主分类号 H01L21/336
代理机构 代理人
主权项 1. A method comprising: forming a plurality of parallel walls on top of a substrate; forming spacers on each side of each of the plurality of walls; forming a trench in the substrate between each of the plurality of walls, such that the spacers define the top of each trench; filling each trench with a dielectric material; removing the walls and a portion of the substrate below the walls, such that channels are formed between the spacers and into the substrate; and etching the dielectric material in each trench to approximately the same depth as the channels.
地址 Boise ID US