发明名称 |
Methods of fabricating fin structures |
摘要 |
There is provided fin methods for fabricating fin structures. More specifically, fin structures are formed in a substrate. The fin structures may include two fins separated by a channel, wherein the fins may be employed as fins of a field effect transistor. The fin structures are formed below the upper surface of the substrate, and may be formed without utilizing a photolithographic mask to etch the fins. |
申请公布号 |
US8748280(B2) |
申请公布日期 |
2014.06.10 |
申请号 |
US201113324520 |
申请日期 |
2011.12.13 |
申请人 |
Micron Technology, Inc. |
发明人 |
Tang Sanh D.;Haller Gordon |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
forming a plurality of parallel walls on top of a substrate; forming spacers on each side of each of the plurality of walls; forming a trench in the substrate between each of the plurality of walls, such that the spacers define the top of each trench; filling each trench with a dielectric material; removing the walls and a portion of the substrate below the walls, such that channels are formed between the spacers and into the substrate; and etching the dielectric material in each trench to approximately the same depth as the channels.
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地址 |
Boise ID US |