Manufacturing method of package carrier

摘要

In a manufacturing method of a package carrier, a substrate including a first metal layer, a second metal layer having a top surface and a bottom surface opposite to each other, and an insulating layer between the first and second metal layers is provided. The second metal layer has a greater thickness than the first metal layer. A first opening passing through the first metal layer and the insulating layer and exposing a portion of the top surface of the second metal layer is formed. The first metal layer is patterned to form a patterned conductive layer. Second openings are formed on the bottom surface of the second metal layer. The second metal layer is divided into thermal conductive blocks by the second openings that do not connect the first opening. A surface passivation layer is formed on the patterned conductive layer and the exposed portion of the top surface.

主权项

1. A manufacturing method of a package carrier, comprising:
providing a substrate, comprising:
providing a insulating layer and a first and a second metal layers respectively located at two opposite sides of the insulating layer; andperforming a thermal compression process, such that the first metal layer, the insulating layer, and the second metal layer are integrated to form the substrate, wherein a thickness of the second metal layer is greater than a thickness of the first metal layer, and the second metal layer has a top surface and a bottom surface opposite to the top surface; forming a first opening passing through the first metal layer and the insulating layer, the first opening exposing a portion of the top surface of the second metal layer; patterning the first metal layer to form a patterned conductive layer; forming a plurality of second openings on the bottom surface of the second metal layer, wherein the second metal layer is divided into a plurality of thermal conductive blocks by the second openings, and the second openings do not communicate with the first opening; and forming a surface passivation layer entirely covering the patterned conductive layer and the portion of the top surface of the second metal layer exposed by the first opening.