| 发明名称 |
Ultrasonic bonding systems and methods of using the same |
| 摘要 |
An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece. |
| 申请公布号 |
US8746537(B2) |
申请公布日期 |
2014.06.10 |
| 申请号 |
US201314059572 |
申请日期 |
2013.10.22 |
| 申请人 |
Orthodyne Electronics Corporation |
发明人 |
Luechinger Christoph B.;Valentin Orlando L.;Xu Tao |
| 分类号 |
B23K1/06;B23K20/10 |
主分类号 |
B23K1/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An ultrasonic bonding system comprising:
a bond head assembly; a bonding tool for bonding a conductive bonding material to a workpiece, the bonding tool being supported by the bond head assembly; and a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool, the pressing member including a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece, wherein a tip portion of the bonding tool is configured to extend through a tool opening defined by the pressing member.
|
| 地址 |
Irvine CA US |
