| 发明名称 |
Process for heat integration by means of a refrigeration system |
| 摘要 |
A process for heat integration in engineering processes is provided in which, in a heat carrier circuit, a heat carrier medium takes up heat from a first process stream in a first heat exchanger and releases it to a refrigeration system. In a refrigerant circuit, a refrigerant is cooled in the refrigeration system and the refrigerant takes up heat from a second process stream in a second heat exchanger or a second process stream is cooled in the refrigeration system. The first process stream is a vapor stream from a thermal separation apparatus, and the temperature of the heat carrier medium is increased by heat supply between egress from the first heat exchanger and ingress into the refrigeration system. |
| 申请公布号 |
US8745995(B2) |
申请公布日期 |
2014.06.10 |
| 申请号 |
US201113268266 |
申请日期 |
2011.10.07 |
| 申请人 |
BASF SE |
发明人 |
Theis Gerhard;Borren Thomas;Schlecht Jörg;Vansant Frans |
| 分类号 |
F25B7/00 |
主分类号 |
F25B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for heat integration in engineering processes, comprising:
in a heat carrier circuit, using a heat carrier medium which takes up heat from a first process stream in a first heat exchanger and releases the heat to a refrigeration system; and in a refrigerant circuit, using a refrigerant which is cooled in the refrigeration system and the refrigerant takes up heat from a second process stream in a second heat exchanger or a second process stream which is cooled in the refrigeration system, wherein the first process stream is a vapor stream from a thermal separation apparatus, and the temperature of the heat carrier medium is increased by heat supply between egress from the first heat exchanger and ingress into the refrigeration system.
|
| 地址 |
Ludwigshafen DE |
