发明名称 SEAMLESS METAL SLEEVE HAVING TRIPLE PLATING LAYER AND MANUFACTURING METHOD OF THESAME
摘要 Provided is a metal sleeve mainly used for a mounting device of an image forming apparatus; a metal sleeve having a triple plated layer plated by a plating method simple to manufacture the metal sleeve; eliminating the phenomenon of brittleness at high temperatures; and having excellent toughness, elasticity, and excellent thermal fixation property along with excellent heat transfer property. The seamless metal sleeve having a triple plated layer includes: a first nickel plated layer plated by electrolytic nickel plating to have uniform thickness and form a cylindrical membrane layer which is hollow inside; a copper plated layer plated by with copper on the outer peripheral surface of the first nickel plated layer using electroplating to form a membrane layer which is thin in thickness; and a second nickel plated layer plated again with nickel on the outer peripheral surface of the copper plated layer using electrolysis nickel electroplating to form a thin membrane layer. The method to manufacture the seamless metal sleeve includes: a step of forming a triple plated layer consisting of membranes by plating the cylindrical master with metallic materials such as nickel, copper, and nickel in a sequential order; a step of reacting sulfur and hydrogen in each plated layer by heat-treating the cylindrical master plated with the triple plated layer in a hydrogen environment at a temperature ranging from 350-600°C; and a step of obtaining the seamless metal sleeve having a triple plated layer by separating the cylindrical master after the triple plated layer being cooled to a temperature ranging from 80-100°C.
申请公布号 KR20140069653(A) 申请公布日期 2014.06.10
申请号 KR20120137189 申请日期 2012.11.29
申请人 URI FINE PLATING CO., LTD. 发明人 JANG, TAE SOON;PARK, YONG BUM;SEO, JEONG HO;RUY, JUNG HAN
分类号 C25D5/14;C23C28/00;C25D5/50 主分类号 C25D5/14
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