| 摘要 |
An apparatus and a method for aligning a semiconductor device are disclosed. The apparatus comprises: a base plate performing posture conversion between a horizontal posture and a tilted posture; and a movable plate installed to slide on an upper surface of the base plate. The movable plate forms a plurality of device accommodation holes and may move in a side direction by a side direction moving part. When such aligning apparatus is in a tilted posture, the apparatus accommodates the semiconductor device, aligns a first side of the semiconductor device, and makes the side direction moving part move the movable plate in a side direction, thereby aligning a second side of the semiconductor device. |
