Method of manufacturing decoupling MIM capacitor designs for interposers

摘要

Decoupling metal-insulator-metal (MIM) capacitor designs for interposers and methods of manufacture thereof are disclosed. In one embodiment, a method of forming a decoupling capacitor includes providing a packaging device, and forming a decoupling MIM capacitor in at least two metallization layers of the packaging device.

主权项

1. A method of forming a decoupling capacitor in an interposer, the method comprising:
providing a workpiece; forming a first metallization layer over the workpiece and a second metallization layer over the first metallization layer, wherein forming the first metallization layer comprises forming a first insulating layer over the workpiece, patterning the first insulating layer, and filling the patterned first insulating layer with a conductive material, and wherein forming the second metallization layer comprises forming a second insulating layer over the workpiece, patterning the second insulating layer, and filling the patterned second insulating layer with a conductive material; forming a decoupling metal-insulator-metal (MIM) capacitor in the first metallization layer and the second metallization layer,wherein forming the decoupling MIM capacitor comprises patterning the first insulating layer and the second insulating layer, and forming a bottom electrode material over the patterned first insulating layer and second insulating layer, forming a capacitor dielectric material over the bottom electrode material, and forming a top electrode material over the capacitor dielectric material; and forming a bottom plate pick-up coupled to the bottom electrode material, before forming the bottom electrode material, wherein forming the bottom plate pick-up comprises forming the bottom plate pick-up in a metallization layer of the interposer disposed beneath the first metallization layer.